Semiconductor
Semiconductor SEM applications connecting metrology, inspection, and review
Semiconductor processes require SEM configuration based on the full MI flow, from CD metrology and defect detection to Review SEM, e-beam inspection, ADR/ADC/EDS, and backside analysis.
Metrology
Review metrology goals such as CD, overlay, Massive CD, and pattern shape measurement.
Inspection / review
Review defect review, VC defects, sub-10nm defects, ADR/ADC classification, and EDS elemental analysis workflows.
Process feedback
Review rapid feedback possibilities through wafer backside review and in-line analysis.
Advanced Process Fit
Backside review needs in next-generation semiconductor processes
In advanced processes such as HBM4 and HBF, it is increasingly important to connect wafer backside defect confirmation, repeat review, and fast process feedback in the fab.
Inspection target300mm wafer backside abnormal locations, suspected defect points, and process-abnormality feedback items
Application valueSecures non-destructive SEM review and elemental-analysis evidence before destructive analysis requests to shorten decision time.
Connected productsBSR-1000 supports the currently consultable application flow, while BSR-2000 covers the next-generation in-line inspection roadmap.