Applications

SEM application structures by industry inspection and analysis needs

Customers often begin with an industry problem rather than a model name. The applications page connects each industry challenge with the right consultation path.

01

Semiconductor Inspection

Review defect review and process feedback using CD-SEM, Defect Review SEM, e-beam inspection, ADR/ADC, and EDS.

02

Battery / EV

Support microstructure analysis workflows for electrodes, separators, particles, coating layers, and cross sections.

03

PCB / FPCB

Review SEM observation conditions for circuit patterns, bonding areas, surface contamination, and micro defects.

04

Materials Analysis

Use SE/BSE imaging and EDS elemental analysis to structure observation goals for metals, ceramics, polymers, and other materials.

Semiconductor Application

In-fab backside review application scenario

This workflow connects in-fab inspection, SEM review, and process feedback when wafer backside abnormalities are suspected.

01Process abnormality

Quickly identify wafer backside abnormalities or suspected defect locations inside the fab.

02Non-destructive SEM review

Collect SEM images and EDS elemental information before wafer shipment or destructive analysis requests.

03Real-time feedback

Connect analysis reports to process feedback for faster next-step decisions and root-cause review.

Need the right equipment structure for your industry?

Request Application Consultation

Advanced Process Fit

Backside review needs in next-generation semiconductor processes

In advanced processes such as HBM4 and HBF, it is increasingly important to connect wafer backside defect confirmation, repeat review, and fast process feedback in the fab.

Inspection target300mm wafer backside abnormal locations, suspected defect points, and process-abnormality feedback items
Application valueSecures non-destructive SEM review and elemental-analysis evidence before destructive analysis requests to shorten decision time.
Connected productsBSR-1000 supports the currently consultable application flow, while BSR-2000 covers the next-generation in-line inspection roadmap.