Semiconductor Inspection
Review defect review and process feedback using CD-SEM, Defect Review SEM, e-beam inspection, ADR/ADC, and EDS.
Applications
Customers often begin with an industry problem rather than a model name. The applications page connects each industry challenge with the right consultation path.
Review defect review and process feedback using CD-SEM, Defect Review SEM, e-beam inspection, ADR/ADC, and EDS.
Support microstructure analysis workflows for electrodes, separators, particles, coating layers, and cross sections.
Review SEM observation conditions for circuit patterns, bonding areas, surface contamination, and micro defects.
Use SE/BSE imaging and EDS elemental analysis to structure observation goals for metals, ceramics, polymers, and other materials.
Semiconductor Application
This workflow connects in-fab inspection, SEM review, and process feedback when wafer backside abnormalities are suspected.
Quickly identify wafer backside abnormalities or suspected defect locations inside the fab.
Collect SEM images and EDS elemental information before wafer shipment or destructive analysis requests.
Connect analysis reports to process feedback for faster next-step decisions and root-cause review.
Advanced Process Fit
In advanced processes such as HBM4 and HBF, it is increasingly important to connect wafer backside defect confirmation, repeat review, and fast process feedback in the fab.