BSR-1000
A Backside Review SEM system that reduces process feedback time through in-fab, non-destructive wafer backside inspection and failure analysis.
SEM & E-beam Technology Partner
SEM solutions for semiconductor in-line metrology, inspection, backside review, and legacy tool improvement.
What We Do
HiKM supports equipment planning and operating-condition review based on practical understanding of semiconductor metrology and inspection, including CD-SEM, Defect Review SEM, e-beam inspection, ADR/ADC/EDS, and wafer backside review.
Key Highlights
Through BSR-1000, BSR-2000, and SEM-REELS, HiKM reduces the limitations of destructive analysis and advances in-fab inspection, review, and process-feedback workflows.
Non-destructive Backside Review SEM application
TAT reduction target
Analysis-volume expansion target
SEM-REELS core-technology collaboration
Why HiKM
HiKM connects product review, technical consultation, and application-specific adoption requirements based on semiconductor metrology and inspection expertise.
Products
The lineup centers on the currently consultable BSR-1000, while BSR-2000 and SEM-REELS are introduced as development-roadmap models with limited public details.
A Backside Review SEM system that reduces process feedback time through in-fab, non-destructive wafer backside inspection and failure analysis.
A next-generation SEM inspection model in the development roadmap. Detailed specifications and public scope will be shared progressively as development advances.
A development model under review as an expanded SEM solution. Product configuration and application scope will be announced when officially disclosed.
Technology
The technology section explains SEM principles, system architecture, application conditions, and differentiators for technical buyers.
Applications
Contact
Share your sample, process, installation environment, resolution needs, and automation scope so the right product path and next consultation step can be reviewed.