Targets advancement of a 300mm Wafer Backside Review SEM platform.
In-LineFab Integration
Reviews linkage with process automation and in-line review workflows.
Flip SystemFront / Back Handling
Includes wafer front/backside damage-free handling and flip system in the development direction.
AIImage Quality / ADC
Reviews AI-based image quality enhancement and automatic defect classification.
VacuumParticle Control
Aims for stable operation based on load lock, vacuum stage, and particle control.
HBM4 / HBFAdvanced Process
Reviews applicability to next-generation high-value semiconductor processes.
Development Items
Development and Application Direction
High-resolution Imaging
Reviews beam stabilization and high-resolution imaging including column, back-bias/retarding voltage, and discharge response technology.
Damage Free Handling
Reviews wafer damage-minimization structure around front/backside handling, holder, stage, and flip system.
Particle Free Vacuum System
Develops toward reduced contamination and particle influence including load lock chamber, vacuum stage, gate valve, and pumping structure.
Software & Factory Automation
Includes integrated GUI, ADR/ADC, AI image quality enhancement, result report, and factory automation linkage.
BSR-2000 is a roadmap product under development. Detailed specifications, release timing, and public performance figures will be updated at official disclosure stages.
Product Inquiry
BSR-2000 Technical Meeting and Roadmap Consultation
Share your process conditions, automation scope, and wafer handling requirements so we can review the BSR-2000 roadmap and application possibilities.
