技術

Technology insight from SEM principles to process applications

SEM scans a sample surface with an electron beam in vacuum and converts signals generated by electron-sample interaction into images and analytical data. HiKM connects this principle to tool selection, defect review, metrology, and maintenance decisions.

Compared with optical microscopy

SEM uses electrons and electromagnetic lenses instead of light and glass lenses. It observes surface microstructures at high magnification in vacuum rather than in air.

Compared with TEM

TEM mainly uses transmitted electron information, while SEM uses signals generated from the sample surface such as secondary and backscattered electrons.

Value in semiconductor inspection

With deep depth of focus, rich surface information, and signal selectivity, SEM supports CD measurement, defect review, elemental analysis, and process feedback.

SEM Comparison

光学顕微鏡とSEMの違い

検査目的と必要分解能に応じて選定基準は異なります。SEMは電子ビーム観察を用いるため、高倍率・高分解能の表面分析に適しています。

光源 / Beam光学顕微鏡は可視光線を使用し、SEMは電子Beamを使用します。
分解能資料基準で光学顕微鏡は200nm以上、SEMは10nm以下水準として比較されます。
倍率光学顕微鏡は10x-3000x、SEMは1,000x-1,000,000x範囲として提示されています。
観察環境光学顕微鏡は大気条件、SEMは真空条件で観察します。
SEM column concept showing electron beam path, lenses, detector, and sample stage
SEM 컬럼과 전자빔 경로를 표현한 기술 이미지

How an SEM system creates an image

The electron beam generated by the electron gun is reduced into a small probe through condenser and objective lenses. Scan coils move the probe across X-Y positions on the sample surface, and detectors convert the signal intensity at each position into image brightness and contrast.

  • Electron gun: stable electron emission and beam current generation
  • Electron lenses: control of probe size, resolution, and focus conditions
  • Vacuum system: reduces electron scattering and sample contamination
  • Detectors: collect SE, BSE, and X-ray signals for each observation goal

Signal Strategy

SEM signals to select by observation goal

This section organizes electron-solid interaction, SEM overview, optical microscope vs. SEM comparison, and SEM analysis characteristics in a way technical buyers can understand quickly.

SE / Secondary electronsSignals generated near the sample surface, suitable for checking surface morphology and micro-pattern contrast.
BSE / Backscattered electronsHigher-energy emitted electrons, useful for composition contrast, subsurface information, and material contrast.
X-ray / EDSUses X-rays generated by electron-sample interaction to identify elemental information at selected locations.
Signal combinationFor defect review and process analysis, SE, BSE, and EDS are interpreted together to connect morphology, composition, and location information.
01Define the goal

Clarify whether the goal is CD measurement, defect review, elemental analysis, or surface observation.

02Set conditions

Tune acceleration voltage, probe current, working distance, and detector choice for the sample and analysis goal.

03Connect to operation

Connect recipes, repeat inspection, ADR/ADC/EDS, data upload, and maintenance into the operating workflow.

SEM Comparison Detail

光学顕微鏡とSEMの主要比較基準

検査目的と必要分解能に応じて装置選定基準が変わるため、光源・分解能・倍率・運用環境をあわせて確認します。

光源光学顕微鏡は可視光を、SEMは電子Beamを使用します。
分解能光学顕微鏡は一般的に200nm以上の領域、SEMは条件により10nm以下の領域まで確認できます。
倍率光学顕微鏡は約10x～3,000x、SEMは約1,000x～1,000,000x水準の高倍率分析に活用されます。
拡大方式光学顕微鏡は光源とレンズによる直接拡大、SEMは走査面積の変化と信号検出に基づいて画像を構成します。
媒質光学顕微鏡は大気条件で運用できますが、SEMは一般的に真空環境を基盤とします。